Title:
SILVER-COATED ALLOY POWDER, CONDUCTIVE PASTE, ELECTRONIC COMPONENT, AND ELECTRICAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/043681
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a metal powder that can be used to form an external electrode that has excellent solder wettability, excellent solder erosion resistance, and excellent conductivity in spite of having less layers. This silver-coated alloy powder has a coat layer containing silver on the surface of alloy core particles containing copper, nickel, zinc, and inevitable impurities.
Inventors:
MASUDA KYOSO (JP)
INOUE KENICHI (JP)
KANESHIRO YUKI (JP)
EBARA ATSUSHI (JP)
MICHIAKI YOSHIYUKI (JP)
OGI KOZO (JP)
YAMADA TAKAHIRO (JP)
YOSHIDA MASAHIRO (JP)
INOUE KENICHI (JP)
KANESHIRO YUKI (JP)
EBARA ATSUSHI (JP)
MICHIAKI YOSHIYUKI (JP)
OGI KOZO (JP)
YAMADA TAKAHIRO (JP)
YOSHIDA MASAHIRO (JP)
Application Number:
PCT/JP2017/031470
Publication Date:
March 08, 2018
Filing Date:
August 31, 2017
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO (JP)
International Classes:
B22F1/00; B22F1/05; B22F1/102; B22F1/17; C22C9/00; C22C9/04; C22C9/06; H01B1/00; H01B1/22; H01B5/00; H01G4/228; H01G4/232; H01G4/30
Domestic Patent References:
WO2013108916A1 | 2013-07-25 | |||
WO2004068506A1 | 2004-08-12 |
Foreign References:
JP2015021143A | 2015-02-02 | |||
JP2005019310A | 2005-01-20 |
Other References:
See also references of EP 3508286A4
Attorney, Agent or Firm:
ANIYA Setuo et al. (JP)
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