Title:
SILVER PARTICLES
Document Type and Number:
WIPO Patent Application WO/2024/070349
Kind Code:
A1
Abstract:
Provided is a conductive adhesive in which silver particles are dispersed in a solvent, the silver particles having excellent fluidity and shape stability after being applied to a member and until before being subjected to sintering. The silver particles dispersed in the solvent have an amine compound attached to the surfaces of the silver particles, wherein when the concentration of the silver particles in the solvent is 50 mass%, the SPAN value, as measured in accordance with the specified condition light transmittance centrifugal sedimentation method, is 0.1 to 3.3. Expression (1): SPAN=(V90-V10)/V50. When a sedimentation speed is indicated in cumulative distribution, a sedimentation speed at 10% cumulative value is V10. A sedimentation speed at 90% cumulative value is V90. A sedimentation speed at 50% cumulative value is V50 (median sedimentation speed).
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Inventors:
OKUDA MASATOSHI (JP)
MORI TAKAMICHI (JP)
KATOU RYO (JP)
TOMOTOSHI DAISUKE (JP)
MORI TAKAMICHI (JP)
KATOU RYO (JP)
TOMOTOSHI DAISUKE (JP)
Application Number:
PCT/JP2023/030335
Publication Date:
April 04, 2024
Filing Date:
August 23, 2023
Export Citation:
Assignee:
OSAKA SODA CO LTD (JP)
International Classes:
B22F1/102; B22F1/00; B22F1/05; B22F1/10; B22F1/107; B22F7/08; B22F9/00
Foreign References:
| JP2019087396A | 2019-06-06 | |||
| JP2016164312A | 2016-09-08 | |||
| JP2004047856A | 2004-02-12 |
Attorney, Agent or Firm:
TANAKA, Junya et al. (JP)
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