Title:
SILVER PARTICLES
Document Type and Number:
WIPO Patent Application WO/2024/070350
Kind Code:
A1
Abstract:
Provided are silver particles which exhibit favorable fluidity and excellent shape stability after being coated onto a member until sintering occurs as a conductive adhesive obtained by dispersing the silver particles in a solvent. Silver particles which are dispersed in a solvent, wherein a compound represented by general formula (1) is adhered to the surface of the silver particles [in general formula (1), R1 is a C1-5 alkyl group, and R2 is a hydrogen atom or a C1-5 alkyl group]. The silver particles have a SPAN value of 0.1-5.0, inclusive, when measured according to a light transmission-type centrifugal sedimentation method under the following conditions and when the concentration of the silver particles in the solvent is 50 mass%. Formula (1) SPAN: (V90-V10)/V50. When the sedimentation rate is expressed as a cumulative distribution, the sedimentation rate which is 10% of the integrated value is V10. Meanwhile, the sedimentation rate which is 90% of the integrated value is V90. The sedimentation rate which is 50% of the integrated value is V50 (median sedimentation rate).
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Inventors:
OKUDA MASATOSHI (JP)
MORI TAKAMICHI (JP)
KATOU RYO (JP)
TOMOTOSHI DAISUKE (JP)
MORI TAKAMICHI (JP)
KATOU RYO (JP)
TOMOTOSHI DAISUKE (JP)
Application Number:
PCT/JP2023/030336
Publication Date:
April 04, 2024
Filing Date:
August 23, 2023
Export Citation:
Assignee:
OSAKA SODA CO LTD (JP)
International Classes:
B22F1/102; B22F1/00; B22F1/05; B22F1/10; B22F1/107; B22F7/08; B22F9/00
Foreign References:
| JP2009074171A | 2009-04-09 | |||
| JP2019087396A | 2019-06-06 | |||
| JP2016164312A | 2016-09-08 | |||
| JP2004047856A | 2004-02-12 |
Attorney, Agent or Firm:
TANAKA, Junya et al. (JP)
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