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Title:
SINGLE CORE BOARD ALIGNMENT METHOD FOR MULTI-LAYER CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/127619
Kind Code:
A1
Abstract:
Provided is a single core board alignment method for a multi-layer circuit board, the method comprising: first, determining a precise region of a set surface of a single core board, wherein the precise region of the set surface of the single core board has a precision region target, and an auxiliary region of the single core board has an auxiliary target; mounting the single core board of a reference board to a board stacking machine; acquiring first coordinates of the precision region target of the single core board of the reference plate and second coordinates of the auxiliary target thereof; then, transporting an Nth layer of single core board to the board stacking machine, wherein N ≥ 2; acquiring third coordinates of the precision region target of the Nth layer of single core board and fourth coordinates of the auxiliary target thereof; and then, stacking the Nth layer of single core board and an (N-1)th layer of single core board, such that the deviation between the third coordinates and the first coordinates is not greater than a first set threshold value A, and the deviation between the fourth coordinates and the second coordinates is not greater than a second set threshold value B. Therefore, the layer deviation between various single core boards is reduced, the overall layer deviation of a multi-layer circuit board is reduced, and the outgoing-line density of the multi-layer circuit board is increased.

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Inventors:
GONG LILI (CN)
XIE ERTANG (CN)
GAO FENG (CN)
YE JINHUA (CN)
Application Number:
PCT/CN2021/135377
Publication Date:
June 23, 2022
Filing Date:
December 03, 2021
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K3/46; H05K1/02; H05K3/00
Foreign References:
CN208079493U2018-11-09
CN104270889A2015-01-07
CN107635362A2018-01-26
CN110769603A2020-02-07
CN103250474A2013-08-14
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
Download PDF:
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