Title:
SLURRY, POLISHING FLUID SET, POLISHING FLUID, AND SUBSTRATE POLISHING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2011/111421
Kind Code:
A1
Abstract:
The disclosed slurry contains abrasive particles and water, said abrasive particles including tetravalent cerium hydroxide particles. An aqueous dispersion containing 1.0% of said abrasive particles by mass exhibits an optical transmittance of at least 50%/cm with respect to light having a wavelength of 500 nm. The disclosed polishing fluid contains abrasive particles, an additive, and water, said abrasive particles including tetravalent cerium hydroxide particles. An aqueous dispersion containing 1.0% of said abrasive particles by mass exhibits an optical transmittance of at least 50%/cm with respect to light having a wavelength of 500 nm.
Inventors:
IWANO TOMOHIRO (JP)
AKIMOTO HIROTAKA (JP)
NARITA TAKENORI (JP)
KIMURA TADAHIRO (JP)
RYUZAKI DAISUKE (JP)
AKIMOTO HIROTAKA (JP)
NARITA TAKENORI (JP)
KIMURA TADAHIRO (JP)
RYUZAKI DAISUKE (JP)
Application Number:
PCT/JP2011/050991
Publication Date:
September 15, 2011
Filing Date:
January 20, 2011
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
IWANO TOMOHIRO (JP)
AKIMOTO HIROTAKA (JP)
NARITA TAKENORI (JP)
KIMURA TADAHIRO (JP)
RYUZAKI DAISUKE (JP)
IWANO TOMOHIRO (JP)
AKIMOTO HIROTAKA (JP)
NARITA TAKENORI (JP)
KIMURA TADAHIRO (JP)
RYUZAKI DAISUKE (JP)
International Classes:
B24B37/04; C09K3/14; H01L21/304
Foreign References:
| JP2009010402A | 2009-01-15 | |||
| JP2009212378A | 2009-09-17 | |||
| JP2010016064A | 2010-01-21 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
Yoshiki Hasegawa (JP)
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Claims:
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