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Patent Searching and Data


Title:
SLURRY FOR THERMAL SPRAYING, THERMAL SPRAYING FILM, AND FORMATION METHOD FOR THERMAL SPRAYING FILM
Document Type and Number:
WIPO Patent Application WO/2014/142017
Kind Code:
A1
Abstract:
This slurry for thermal spraying contains 10%-85% by mass ceramic particles and has a viscosity of no more than 300 mPa·s. The ceramic particles have an average particle diameter of, e.g., 1-5 nm. The slurry for thermal spraying can also contain a dispersant. The slurry for thermal spraying can also contain a viscosity modifier. The slurry for thermal spraying can also contain a coagulant.

Inventors:
KITAMURA JUNYA (JP)
MIZUNO HIROAKI (JP)
SATO KAZUTO (JP)
TSUZUKI KAZUYUKI (JP)
Application Number:
PCT/JP2014/055934
Publication Date:
September 18, 2014
Filing Date:
March 07, 2014
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Assignee:
FUJIMI INC (JP)
International Classes:
C23C4/10; C09K23/16; C09K23/52; C23C4/12
Foreign References:
JP2011522115A2011-07-28
JP2011524944A2011-09-08
Attorney, Agent or Firm:
ONDA, Makoto et al. (JP)
Makoto Onda (JP)
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