Title:
SOCKET
Document Type and Number:
WIPO Patent Application WO/2022/270311
Kind Code:
A1
Abstract:
A socket (10) comprises: a probe (100) that includes a first tapered section (102); and an insulative support body (200) to which is provided a through hole (230) having a second tapered section (202) that receives the first tapered section (102). A first taper angle (α) of the first tapered section (102) is less than a second taper angle (β) of the second tapered section (202).
Inventors:
HOSOKAWA DAISUKE (JP)
Application Number:
PCT/JP2022/023122
Publication Date:
December 29, 2022
Filing Date:
June 08, 2022
Export Citation:
Assignee:
YOKOWO SEISAKUSHO KK (JP)
International Classes:
G01R1/06; G01R1/067; G01R31/26; H01R13/24; H01R33/76
Domestic Patent References:
WO2020202735A1 | 2020-10-08 | |||
WO2019131438A1 | 2019-07-04 |
Foreign References:
JP2021092435A | 2021-06-17 | |||
JP2013140058A | 2013-07-18 | |||
JPH1019926A | 1998-01-23 | |||
JP2022079959A | 2022-05-27 | |||
JP2006308486A | 2006-11-09 | |||
JP2021104560A | 2021-07-26 |
Attorney, Agent or Firm:
HAYAMI Shinji et al. (JP)
Download PDF:
Previous Patent: CONTROL DEVICE, CONTROL SYSTEM, CONTROL METHOD, AND EJECTION DEVICE
Next Patent: BONDING WIRE FOR SEMICONDUCTOR DEVICE
Next Patent: BONDING WIRE FOR SEMICONDUCTOR DEVICE