Title:
SOFT ERROR INSPECTION METHOD, SOFT ERROR INSPECTION DEVICE, AND SOFT ERROR INSPECTION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2018/225136
Kind Code:
A1
Abstract:
The present invention solves the problem of related art by providing a soft error inspection method for a semiconductor device, which is characterized by having a step for irradiating laser light or an electron beam onto a semiconductor device so as to scan the semiconductor device and a step for measuring and storing the bit flip time for each area of the semiconductor device irradiated with the laser light or electron beam.
Inventors:
SOEDA TAKESHI (JP)
Application Number:
PCT/JP2017/020863
Publication Date:
December 13, 2018
Filing Date:
June 05, 2017
Export Citation:
Assignee:
FUJITSU LTD (JP)
International Classes:
G01R31/30; G01R31/26
Domestic Patent References:
| WO2011007708A1 | 2011-01-20 |
Foreign References:
| JP2017040543A | 2017-02-23 | |||
| JPH01248070A | 1989-10-03 | |||
| JP2014134842A | 2014-07-24 | |||
| JP2004125633A | 2004-04-22 | |||
| US20100001738A1 | 2010-01-07 | |||
| JP2011504581A | 2009-04-09 |
Other References:
J. R. SCHWANK ET AL., IEEE TRANS. NUCL. SCI., vol. 57, 2010, pages 1827
See also references of EP 3637118A4
See also references of EP 3637118A4
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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