Title:
SOLDER ALLOY, AND MAKING USE OF THE SOLDER ALLOY, ELECTRONIC SUBSTRATE AND PROCESS FOR PRODUCING THE SAME
Document Type and Number:
WIPO Patent Application WO/2007/029329
Kind Code:
A1
Abstract:
A solder alloy for use in flow soldering technique, comprising a lead-free Sn-Zn-Al alloy. The solder alloy consists, for example, of a composition comprising 3.0 to 14.0 wt.% Zn, 0.003 to 0.050 wt.% Al and the balance of Sn. Further, there are disclosed, making use of the solder alloy, an electronic substrate and process for producing the electronic substrate.
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Inventors:
YAMAMOTO KEIICHI (JP)
Application Number:
PCT/JP2005/016580
Publication Date:
March 15, 2007
Filing Date:
September 09, 2005
Export Citation:
Assignee:
FUJITSU LTD (JP)
YAMAMOTO KEIICHI (JP)
YAMAMOTO KEIICHI (JP)
International Classes:
B23K35/26; H05K3/34
Domestic Patent References:
| WO2002034969A1 | 2002-05-02 | |||
| WO2003061896A1 | 2003-07-31 |
Foreign References:
| JP2001347394A | 2001-12-18 | |||
| JP2000015478A | 2000-01-18 | |||
| JP2005238297A | 2005-09-08 | |||
| JP2000210788A | 2000-08-02 | |||
| US4042725A | 1977-08-16 | |||
| JPS5942197A | 1984-03-08 |
Attorney, Agent or Firm:
ITOH, Tadahiko (Yebisu Garden Place Tower 20-3, Ebisu 4-chom, Shibuya-ku Tokyo, JP)
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