Title:
SOLDER ALLOY, SOLDER POWDER, SOLDER PASTE, AND A SOLDER JOINT USING THESE
Document Type and Number:
WIPO Patent Application WO/2020/017157
Kind Code:
A1
Abstract:
This solder alloy has an alloy composition of As: 25-300 ppm by mass, Bi: 0-25,000 ppm by mass and Pb: greater than 0 and less than or equal to 8000 ppm by mass, with the remainder consisting of Sn, and satisfies formula (1) and formula (2) below. (1)...275 ≤ 2As + Bi + Pb (2)...2.3×10-4×Bi + 8.2×10-4×Pb ≤ 7 In formula (1) and formula (2), As, Bi and Pb represent content (ppm by mass) thereof in the alloy composition.
Inventors:
KAWASAKI HIROYOSHI (JP)
MUNEKATA OSAMU (JP)
SHIRATORI MASATO (JP)
MUNEKATA OSAMU (JP)
SHIRATORI MASATO (JP)
Application Number:
PCT/JP2019/020855
Publication Date:
January 23, 2020
Filing Date:
May 27, 2019
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
B23K35/26; B23K35/22; C22C13/00; C22C13/02; B23K35/363
Foreign References:
| JP2002224881A | 2002-08-13 | |||
| JP2016500578A | 2016-01-14 | |||
| JP2015020182A | 2015-02-02 | |||
| JP2015098052A | 2015-05-28 | |||
| JP2016537206A | 2016-12-01 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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