Title:
SOLDER ALLOY, SOLDERING PASTE, SOLDER BALL, SOLDERING PREFORM, SOLDER JOINT, ON-VEHICLE ELECTRONIC CIRCUIT, ECU ELECTRONIC CIRCUIT, ON-VEHICLE ELECTRONIC CIRCUIT DEVICE, AND ECU ELECTRONIC CIRCUIT DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/261486
Kind Code:
A1
Abstract:
This solder alloy comprises: 3.1 to 4.0 mass% of Ag; 0.6 to 0.8 mass% of Cu; 1.5 to 5.5 mass% of Bi; 1.0 to 6.0 mass% of Sb; 0.001 to 0.030 mass% of Co; 0.02 to 0.05 mass% of Fe; and Sn as the balance.
Inventors:
YOSHIKAWA SHUNSAKU (JP)
SAITO TAKASHI (JP)
IIJIMA YUUKI (JP)
DEI KANTA (JP)
MATSUFUJI TAKAHIRO (JP)
SAITO TAKASHI (JP)
IIJIMA YUUKI (JP)
DEI KANTA (JP)
MATSUFUJI TAKAHIRO (JP)
Application Number:
PCT/JP2021/023598
Publication Date:
December 30, 2021
Filing Date:
June 22, 2021
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
International Classes:
C22C13/00; B23K35/22; B23K35/26; C22C13/02
Domestic Patent References:
| WO2014163167A1 | 2014-10-09 | |||
| WO2014163167A1 | 2014-10-09 |
Foreign References:
| JP2015077601A | 2015-04-23 | |||
| JP2016179498A | 2016-10-13 | |||
| JP6624322B1 | 2019-12-25 | |||
| US20020127136A1 | 2002-09-12 | |||
| JP2020104169A | 2020-07-09 |
Other References:
See also references of EP 4019652A4
Attorney, Agent or Firm:
UMEDA Shinsuke et al. (JP)
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