Title:
SOLDER JOINT AND BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/009427
Kind Code:
A1
Abstract:
Provided are a solder joint in which βSn grains are oriented in a specific desired direction, the βSn grains having a desired structure, and a bonding method relating to the solder joint. Provided is a solder joint in which at least two copper substrates (2) are bonded to each other using a lead-free solder alloy including Sn. A solder ball (1) relating to the lead-free solder alloy comprises: one or a plurality of nucleation grains (4); and a single grain βSn of which a [001] direction is parallel with a facet plane of the nucleation grains (4), and which is crystal-oriented in a specific direction with respect to the copper substrates (2).
Inventors:
NISHIMURA TETSURO (JP)
SWEATMAN KEITH (JP)
NISHIMURA TAKATOSHI (JP)
GOURLAY CHRISTOPHER (GB)
MA ZHAOLONG (GB)
BELYAKOV SERGEY (GB)
SWEATMAN KEITH (JP)
NISHIMURA TAKATOSHI (JP)
GOURLAY CHRISTOPHER (GB)
MA ZHAOLONG (GB)
BELYAKOV SERGEY (GB)
Application Number:
PCT/JP2018/025799
Publication Date:
January 10, 2019
Filing Date:
July 02, 2018
Export Citation:
Assignee:
NIHON SUPERIOR CO LTD (JP)
IMPERIAL INNOVATIONS LTD (GB)
IMPERIAL INNOVATIONS LTD (GB)
International Classes:
B23K1/20; B23K35/26; H05K3/34; C22C13/00
Foreign References:
| JP2007134476A | 2007-05-31 | |||
| JPH1072694A | 1998-03-17 |
Attorney, Agent or Firm:
KOHNO, Hideto et al. (JP)
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