Title:
SOLDER PARTICLE CLASSIFYING METHOD, MONODISPERSED SOLDER PARTICLE, AND SOLDER PARTICLE CLASSIFYING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/239124
Kind Code:
A1
Abstract:
This solder particle classifying method includes: a first step of forming an electric field between a first electrode 2 and a second electrode 3 which are included in an electrostatic attraction device, the first electrode 2 comprising a disposition part that has electrical conductivity or electrostatic diffusivity, the second electrode 3 comprising an insulating attraction part 4 that faces the disposition part and that is provided with a plurality of openings 10 opened to the disposition part side, whereby solder particles P disposed in the disposition part are electrostatically attracted to the attraction part 4; a second step of removing solder particles P2 attracted to a portion excluding the openings 10 of the attraction part 4; and a third step of collecting, from the attraction part 4 having been through the second step, solder particles P1 accommodated in the openings. The average particle size of the solder particles P is 10 μm or more.
More Like This:
Inventors:
TOSHIYUKI SUGIMOTO (JP)
YAMAZAKI SHOHEI (JP)
IZAWA HIROYUKI (JP)
YAMAZAKI SHOHEI (JP)
IZAWA HIROYUKI (JP)
Application Number:
PCT/JP2021/017922
Publication Date:
November 17, 2022
Filing Date:
May 11, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
TOSHIYUKI SUGIMOTO (JP)
TOSHIYUKI SUGIMOTO (JP)
International Classes:
B03C7/02; B07B13/04
Domestic Patent References:
WO2020004510A1 | 2020-01-02 | |||
WO2021095726A1 | 2021-05-20 |
Foreign References:
JPH11152598A | 1999-06-08 | |||
JP2021057293A | 2021-04-08 | |||
JP2021028895A | 2021-02-25 | |||
JP2019202239A | 2019-11-28 | |||
JP2004113929A | 2004-04-15 | |||
JP2004025128A | 2004-01-29 | |||
JP2003272790A | 2003-09-26 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: