Title:
SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR PRODUCING MEMBER WITH SOLDER BUMPS
Document Type and Number:
WIPO Patent Application WO/2022/168209
Kind Code:
A1
Abstract:
A method for forming solder bumps with use of a solder paste that contains solder particles, a flux and a volatile dispersion medium, the method comprising: a step for applying the solder paste to a member which has a plurality of electrodes on the surface; a step for forming a solder particle-containing layer by heating the member and the solder paste at a temperature that is less than the melting point of a solder that constitutes the solder particles; a step for forming solder bumps by heating the member and the solder particle-containing layer at a temperature that is not less than the melting point of the solder that constitutes the solder particles; and a step for removing residues of the solder particle-containing layer by means of cleaning, the residues remaining between adjacent solder bumps. With respect to this method for forming solder bumps, the solder particles have an average particle diameter of 10 μm or less, and the content of the dispersion medium in the solder paste is 30% by mass or more.
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Inventors:
EJIRI YOSHINORI (JP)
SUKATA SHINICHIROU (JP)
AKAI KUNIHIKO (JP)
SAKAMOTO MASUMI (JP)
SHIMIZU CHIAKI (JP)
HATA JUNICHI (JP)
YOSHIBA AYUMI (JP)
SUKATA SHINICHIROU (JP)
AKAI KUNIHIKO (JP)
SAKAMOTO MASUMI (JP)
SHIMIZU CHIAKI (JP)
HATA JUNICHI (JP)
YOSHIBA AYUMI (JP)
Application Number:
PCT/JP2021/003966
Publication Date:
August 11, 2022
Filing Date:
February 03, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L21/60; H05K3/34
Foreign References:
| JP2012004347A | 2012-01-05 | |||
| JP2007123558A | 2007-05-17 | |||
| JP2020198394A | 2020-12-10 | |||
| JP2008545257A | 2008-12-11 | |||
| US20170368643A1 | 2017-12-28 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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