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Title:
SOLDER PASTE
Document Type and Number:
WIPO Patent Application WO/2016/157971
Kind Code:
A1
Abstract:
Provided is a solder paste which contains a metal powder, and wherein: the metal powder is composed of a tin powder and an alloy powder containing bismuth and silver; and the alloy powder containing bismuth and silver contains silver in an amount of from 0.1% by mass to 11.0% by mass (inclusive).

Inventors:
TAKAMORI MASATO (JP)
Application Number:
PCT/JP2016/052335
Publication Date:
October 06, 2016
Filing Date:
January 27, 2016
Export Citation:
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Assignee:
SUMITOMO METAL MINING CO (JP)
International Classes:
B23K35/26; B23K35/22; C22C12/00
Foreign References:
JP2013525121A2013-06-20
JP2013220466A2013-10-28
JP2014045222A2014-03-13
JP2012172178A2012-09-10
JP2012061508A2012-03-29
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Tadashige Ito (JP)
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