Title:
PHOTOCURABLE/THERMOCURABLE SOLDER RESIST COMPOSITION, AND PRINTED CIRCUIT BOARD USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2008/050768
Kind Code:
A1
Abstract:
Disclosed is a white-colored photocurable and thermocurable solder resist composition which enables to form a highly reflective solder resist film that is hardly deteriorated by light or heat. Also disclosed is a printed circuit board having a highly reflective solder resist film formed by using the white-colored photocurable and thermocurable solder resist composition.
Inventors:
DAIGO YOSHIKAZU (JP)
USHIKI SHIGERU (JP)
USHIKI SHIGERU (JP)
Application Number:
PCT/JP2007/070654
Publication Date:
May 02, 2008
Filing Date:
October 23, 2007
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
DAIGO YOSHIKAZU (JP)
USHIKI SHIGERU (JP)
DAIGO YOSHIKAZU (JP)
USHIKI SHIGERU (JP)
International Classes:
G03F7/004; G03F7/027; H05K3/28
Foreign References:
| JP2005031102A | 2005-02-03 | |||
| JPH10142797A | 1998-05-29 | |||
| JP2001075281A | 2001-03-23 | |||
| JPH03101686A | 1991-04-26 | |||
| JP2005101047A | 2005-04-14 | |||
| JP2002033570A | 2002-01-31 | |||
| JP2007249148A | 2007-09-27 |
Attorney, Agent or Firm:
SUZUYE, Takehiko et al. (1-12-9 Toranomo, Minato-kuTokyo 01, JP)
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