SOLDERING DEVICE AND MOVEABLE PARTITIONING MEMBER STRUCTURE

WIPO Patent Application WO/2011/125668

A1

In the disclosed soldering device, the configuration of a labyrinth section that hangs down on the side where a heat treatment unit, a cooling treatment unit, and the like are is engineered such that the distance the labyrinth section hangs down can be freely adjusted in accordance with the attachment height of an electronic component. As shown in figures 13A to 13C, the disclosed soldering device is provided with a plurality of covers (31) that seal the top of a heat treatment unit that heat-treats a substrate. Each cover (31) has a movable partitioning member mechanism (40) that includes: a main housing (301) that has a plurality of slits (41) on one side and long hole sections (42a to 42d) on the other side; a labyrinth section (43), one end of which is threaded through the slits (41),which hangs down on the side where the heat treatment unit is; a sliding substrate (44), to which the other ends of the labyrinth section (43) are attached, which is installed inside the main housing (301) and engages so as to be able to slide in the substrate transport direction of the main housing (301); and affixing members (45a and 45b) that affix the sliding substrate (44) to the main housing (301) via the long hole sections (42a and 42d).

SUZUKI TAKASHI (JP)

PCT/JP2011/057872

October 13, 2011

March 29, 2011

Click for automatic bibliography generation  

SENJU METAL INDUSTRY CO (JP)
SUZUKI TAKASHI (JP)

H05K3/34; B23K1/00; B23K1/008; B23K1/08; B23K31/02

JP2006185983A	2006-07-13
JPH10303543A	1998-11-13
JPH05305429A	1993-11-19

YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Yamaguchi international patent firm (JP)

View/Download PDF      PDF Help

Previous Patent: VIBRATION ISOLATION DEVICE

Next Patent: SOLDERING DEVICE AND COVER SUPPORT/SEALING STRUCTURE