Title:
SOLDERING DEVICE AND COVER SUPPORT/SEALING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2011/125669
Kind Code:
A1
Abstract:
In the disclosed soldering device, a support and sealing mechanism for covers for a preheating/cooling/etc. treatment vessel is engineered such that the covers can slide freely on top of the treatment vessel and can be supported and sealed with a high degree of airtightness. As shown in figure 2, the disclosed soldering device is provided with a cover support/sealing mechanism (30) that uses a plurality of covers (32) to seal the top of a rectangular heat-treatment unit (20) that has an opening in the upper part thereof. The cover support/sealing mechanism (30) comprises: a plurality of covers (32) that cover the top of the opening in the heat-treatment unit (20), each cover having a pair of multi-grooved rail-like engaging groove parts provided in a prescribed direction; and sliding support members (35a and 35b) that slidably support the covers (32) and have a pair of multi-grooved rail-like engaged groove parts provided along opposing sides of the opening in the heat-treatment unit (20). The engaging groove parts in the covers (32) fit into the engaged groove parts in the sliding support members (35a and 35b).
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Inventors:
SUZUKI TAKASHI (JP)
Application Number:
PCT/JP2011/057874
Publication Date:
October 13, 2011
Filing Date:
March 29, 2011
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
SUZUKI TAKASHI (JP)
SUZUKI TAKASHI (JP)
International Classes:
H05K3/34; B23K1/00; B23K1/008; B23K1/08; B23K31/02
Foreign References:
| JPH07202405A | 1995-08-04 | |||
| JPH06170523A | 1994-06-21 | |||
| JPH0313091U | 1991-02-08 | |||
| JPH0380162A | 1991-04-04 |
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Yamaguchi international patent firm (JP)
Patent business corporation Yamaguchi international patent firm (JP)
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Claims: