Title:
SOLDERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/164776
Kind Code:
A1
Abstract:
In order to provide a soldering device which is capable, during soldering, of reducing defective solders in which air bubbles remain in the solder and which also has good cooling efficiency, this soldering device heats and melts solder between two members, then degasses said solder in a reduced pressure atmosphere and then cools said solder, and is provided with: a processing chamber (2) which, provided with a means for heating and melting solder, heats and melts the solder with said means and then degasses said solder in a reduced pressure atmosphere; and a means (3) for cooling the solder on a member conveyed out of the processing chamber (2), wherein the processing chamber (2) and the cooling means (3) are arranged inside of an inert gas chamber (1) filled with an inert gas. The present invention is preferably further configured such that the heating and melting means has a heater (13) and a fan (14), and such that the fan (14) circulates inside of the processing chamber (2) the atmospheric gas heated in the heater (13), heating and melting the solder.
Inventors:
YOKOTA YATSUHARU (JP)
Application Number:
PCT/JP2011/079152
Publication Date:
December 06, 2012
Filing Date:
December 16, 2011
Export Citation:
Assignee:
YOKOTA TECHNICA LTD COMPANY (JP)
YOKOTA YATSUHARU (JP)
YOKOTA YATSUHARU (JP)
International Classes:
B23K1/008; B23K3/04; B23K31/02; H05K3/34; B23K101/42
Foreign References:
| JP2007000915A | 2007-01-11 | |||
| JP2004181483A | 2004-07-02 | |||
| JPH06226484A | 1994-08-16 | |||
| JP2010161206A | 2010-07-22 | |||
| JP2004207645A | 2004-07-22 | |||
| JPH09314322A | 1997-12-09 |
Attorney, Agent or Firm:
HIRANO Genyo (JP)
Hirotaka Hirano (JP)
Hirotaka Hirano (JP)
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Claims: