Title:
SOLDERING METHOD AND APPARATUS FOR MOUNTING COMPONENT ON PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2008/015731
Kind Code:
A1
Abstract:
When a component is soldered to a printed wiring board (45) for mounting, the printed
wiring board to which the component is soldered is heated in a high-oxygen-concentration
oxygen atmosphere for forming oxide films (31-39) on the surface of joined portions
(109, 111-114). Consequently, the component soldered to the surface of the printed
wiring board is prevented from dropping, displacement or lifting from the printed
wiring board during reflow of the printed wiring board.
Inventors:
ISHIKAWA TETSUJI (JP)
SAITO OSAMU (JP)
SAITO OSAMU (JP)
Application Number:
PCT/JP2006/315161
Publication Date:
February 07, 2008
Filing Date:
July 31, 2006
Export Citation:
Assignee:
FUJITSU LTD (JP)
ISHIKAWA TETSUJI (JP)
SAITO OSAMU (JP)
ISHIKAWA TETSUJI (JP)
SAITO OSAMU (JP)
International Classes:
B23K1/00; H05K3/34
Foreign References:
| JP2003037357A | 2003-02-07 | |||
| JPH07142491A | 1995-06-02 | |||
| JP2003298224A | 2003-10-17 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (Toranomon 37 Mori Bldg.5-1, Toranomon 3-chom, Minato-ku Tokyo, JP)
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