SOLID IMAGING DEVICE AND MANUFACTURING METHOD THEREOF

WIPO Patent Application WO/2007/083564

A1

It is possible to provide a solid state imaging device and its manufacturing method capable of reducing the device size and improving the productivity. The solid state imaging device has a 3D structure for mounting a solid state imaging element and a translucent member. The 3D structure includes: a solid state imaging element mounting unit formed by an insulating resin and having a through opening for mounting the solid state element on the opening surface to which the light receiving surface of the solid state imaging element faces; and a stepped portion for mounting the translucent member on the brim of the opening surface. The light receiving surface and the translucent member are mounted at a predetermined interval so as to cover the through opening.

JPS6385529	PHOTOMETER FOR ELECTRONIC CAMERA
JP4130891	A method for manufacturing a CMOS image sensor in which the depth of the photodiode differs depending on the wavelength of light and a method for forming the photodiode.

HARAZONO HUMIKAZU
NAKAGIRI YASUSHI
SUGAHARA KEN

PCT/JP2007/050246

July 26, 2007

January 11, 2007

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MATSUSHITA ELECTRIC IND CO LTD (JP)
HARAZONO HUMIKAZU
NAKAGIRI YASUSHI
SUGAHARA KEN

H01L27/14; H04N5/225; H04N5/335

JP2001333332A	2001-11-30
JP2002135632A	2002-05-10
JP2004327914A	2004-11-18
JP2003189195A	2003-07-04
JP2001358997A	2001-12-26

TAKAMATSU, Takeshi et al. (7-13 Nishi-Shimbashi 1-chome, Minato-k, Tokyo03, JP)

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