SOLID IMAGING ELEMENT, MANUFACTURING METHOD, AND RADIATION IMAGING DEVICE

WIPO Patent Application WO/2016/027730

A1

The present disclosure relates to a solid imaging element enabling the noise characteristics and the dark characteristics to be prevented from deteriorating when capturing an image of radiation, a manufacturing method, and a radiation imaging device. A scintillator converts radiation to visible light. Pixels each including a photodiode are formed in a semiconductor substrate, said photodiode performing photoelectric conversion on the visible light converted by the scintillator. Only a silicon oxide film or a negative fixed charge film is formed on the substrate in a pixel element isolation region. The present disclosure is applicable to, for example, a radiation imaging device for capturing an image of X-ray with which a subject is irradiated and the like.

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YANAGITA TAKESHI (JP)
SUZUKI ATSUSHI (JP)
KOMATSU YOSHIHIRO (JP)
TAKEDA YUITI (JP)
OISHI TETSUYA (JP)
OSHIYAMA ITARU (JP)
OTA KAZUNOBU (JP)
MIYAZAWA SHINJI (JP)
OISHI HIDETOSHI (JP)

PCT/JP2015/072723

February 25, 2016

August 11, 2015

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SONY CORP (JP)

H01L27/146; G01T1/20; H04N5/32; H04N5/369

JP2007158031A	2007-06-21
JP5424371B1	2014-02-26
JP2013090139A	2013-05-13
JP2008306154A	2008-12-18
JP2013229606A	2013-11-07
JP2007088305A	2007-04-05

NISHIKAWA Takashi et al. (JP)
Nishikawa 孝 (JP)

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