Title:
SOLID-STATE IMAGE PICKUP ELEMENT AND SOLID-STATE IMAGE PICKUP DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/047517
Kind Code:
A1
Abstract:
A solid-state image pickup element of one embodiment of the present disclosure is provided with the following: a first electrode comprising a plurality of electrodes; a second electrode that is disposed opposing the first electrode; and a photoelectric conversion layer that is provided between the first electrode and the second electrode. The first electrode includes an overlap section in which at least some of the plurality of electrodes overlap with a first insulation layer therebetween.
Inventors:
MATSUO HIROAKI (JP)
Application Number:
PCT/JP2017/027603
Publication Date:
March 15, 2018
Filing Date:
July 31, 2017
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H04N5/357; H04N5/374
Foreign References:
| JP2016127264A | 2016-07-11 | |||
| JP2003258215A | 2003-09-12 | |||
| JP2016086407A | 2016-05-19 |
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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