Title:
SOLID-STATE IMAGE PICKUP ELEMENT
Document Type and Number:
WIPO Patent Application WO/2019/087471
Kind Code:
A1
Abstract:
The present invention reduces a mounting area in a solid-state image pickup element that detects an address event. This solid-state image pickup element is provided with a light receiving chip and a detection chip. In the solid-state image pickup element that is provided with the light receiving chip and the detection chip, the light receiving chip is provided with a photodiode that generates a photocurrent by photoelectrically converting inputted light. Furthermore, in the solid-state image pickup element, the detection chip quantizes a voltage signal corresponding to the photocurrent having been generated by the photodiode in the light receiving chip, and outputs the signal as a detection signal.
Inventors:
NIWA ATSUMI (JP)
Application Number:
PCT/JP2018/026757
Publication Date:
May 09, 2019
Filing Date:
July 17, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/3745; H01L27/146
Domestic Patent References:
| WO2017098725A1 | 2017-06-15 |
Foreign References:
| JP2017028690A | 2017-02-02 | |||
| JP2017103544A | 2017-06-08 | |||
| JP2016533140A | 2016-10-20 |
Other References:
See also references of EP 3582491A4
Attorney, Agent or Firm:
MARUSHIMA, Toshikazu (JP)
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