Title:
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/190166
Kind Code:
A1
Abstract:
An imaging device is provided includes a plurality of pixels (200-1). A pixel (200-1) of the plurality of pixels includes: a first wiring coupled to a floating diffusion (221); a second wiring opposed to the first wiring such that a wiring capacitance (Cfd-vsl) is formed; a pixel amplifier (214) with a feedback capacitance that is based on the wiring capacitance; and a vertical signal line (22) arranged to output a signal from the floating diffusion. The wiring capacitance is formed between the floating diffusion and the vertical signal line.
Inventors:
TAGAWA YUKIO (JP)
YOSHIKAWA KOJI (JP)
YORIKADO YUHI (JP)
BABA KOICHI (JP)
YOSHIKAWA KOJI (JP)
YORIKADO YUHI (JP)
BABA KOICHI (JP)
Application Number:
PCT/JP2018/014066
Publication Date:
October 18, 2018
Filing Date:
April 02, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146
Domestic Patent References:
| WO2016030801A1 | 2016-03-03 |
Foreign References:
| US20150076327A1 | 2015-03-19 | |||
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Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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