Title:
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/158400
Kind Code:
A1
Abstract:
This technology relates to a solid-state imaging device and an electronic apparatus that enable wiring failures to be rectified with little redundancy. The solid-state imaging device comprises: a pixel array unit in which a plurality of pixels are disposed two-dimensionally in a matrix; one redundancy wire per n signal lines that transmit pixel signals from the pixels; and at least one redundancy switch that connects one signal line and the redundancy wire.
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Inventors:
ASAKURA LUONGHUNG (JP)
Application Number:
PCT/JP2020/001164
Publication Date:
August 06, 2020
Filing Date:
January 16, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H04N5/369; H01L27/146; H04N5/367; H04N5/378
Foreign References:
| JP2015185860A | 2015-10-22 | |||
| JP2002100753A | 2002-04-05 | |||
| JP2018057048A | 2018-04-05 | |||
| JP2018186478A | 2018-11-22 | |||
| JP2017184075A | 2017-10-05 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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