Title:
SOLID-STATE IMAGING DEVICE, METHOD FOR PRODUCING SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/091615
Kind Code:
A1
Abstract:
Provided is a solid-state imaging device that makes it possible to achieve further improvements in the quality and reliability of a solid-state imaging device. This solid-state imaging device comprises: a first substrate; a second substrate that is layered on the first substrate by being directly bonded thereto on the side opposite from the light incident side of the first substrate, and that has a different size than that of the first substrate; a third substrate that is provided on the side opposite from the light incident side of the second substrate; and an insulating layer that is formed between the first substrate and the third substrate. The third substrate includes a well that is formed on the light incident side of the third substrate.
Inventors:
AKIYAMA KENTARO (JP)
HIRATSUKA TATSUMASA (JP)
KAMEI TAKAHIRO (JP)
NITTA YOSUKE (JP)
HIRATSUKA TATSUMASA (JP)
KAMEI TAKAHIRO (JP)
NITTA YOSUKE (JP)
Application Number:
PCT/JP2021/033839
Publication Date:
May 05, 2022
Filing Date:
September 15, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H04N5/369; H04N5/374
Domestic Patent References:
| WO2019087764A1 | 2019-05-09 | |||
| WO2020129686A1 | 2020-06-25 |
Foreign References:
| JP2020150112A | 2020-09-17 | |||
| US20180026067A1 | 2018-01-25 | |||
| US20190333957A1 | 2019-10-31 |
Attorney, Agent or Firm:
WATANABE Kaoru (JP)
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