Title:
SOLID-STATE IMAGING DEVICE AND IMAGING DEVICE WITH COMBINED DYNAMIC VISION SENSOR AND IMAGING FUNCTIONS
Document Type and Number:
WIPO Patent Application WO/2021/112151
Kind Code:
A1
Abstract:
An imaging device with a plurality of image sensing pixels and a plurality of event detection pixels is provided. Each image sensing pixel includes a photoelectric conversion element and an imaging signal generation readout circuit. The image sensing readout circuit can be shared by a plurality of photoelectric conversion elements. Each event detection pixel includes a photoelectric conversion element and an event detection readout circuit. The event detection readout circuit can be shared by a plurality of photoelectric conversion elements. In addition, the photoelectric conversion element of an event detection pixel can be selectively connected to a shared imaging signal generation readout circuit. The number of image sensing pixels is greater than the number of event detection pixels. In addition, the area of a photoelectric conversion element of an event detection pixel can be greater than the area of a photoelectric conversion element of an image sensing pixel.
Inventors:
MOSTAFALU POORIA (US)
MEHTA GIRI (US)
BRADY FREDERIC (US)
WONG PING WAH (US)
MEHTA GIRI (US)
BRADY FREDERIC (US)
WONG PING WAH (US)
Application Number:
PCT/JP2020/044942
Publication Date:
June 10, 2021
Filing Date:
December 02, 2020
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146
Foreign References:
| US20150302710A1 | 2015-10-22 | |||
| US20190296070A1 | 2019-09-26 | |||
| US20190051685A1 | 2019-02-14 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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