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Title:
SOLID-STATE IMAGING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/207340
Kind Code:
A1
Abstract:
This solid-state imaging device is provided with a two-dimensional pixel array comprising unit pixels arrayed on a semiconductor substrate, each including a photo-electric conversion element converting incoming light into electrical signals, and a circuit element reading the converted electrical signals. With a plurality of adjacent unit pixels defined as one pixel group set, the two-dimensional pixel array comprises a row of a plurality of the one pixel group sets. The periphery of the one pixel group sets is surrounded, except for the mid-section of the plurality of adjacent unit pixels, by an insulating element dividing region that divides the semiconductor substrate into elements.

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JPS5749266SOLID-STATE IMAGE SENSING PLATE
WO/2016/194717SOLID-STATE IMAGING ELEMENT, PHOTOELECTRIC CONVERSION FILM, ELECTRON BLOCKING LAYER, IMAGING DEVICE AND ELECTRONIC DEVICE
WO/2014/059920PIXEL CELL, METHOD FOR MANIFACTURING THE SAME AND IMAGE SENSOR COMPRISING THE SAME
Inventors:
AOKI JUN (JP)
KOYAMA YUSAKU (JP)
Application Number:
PCT/JP2017/018015
Publication Date:
November 15, 2018
Filing Date:
May 12, 2017
Export Citation:
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Assignee:
OLYMPUS CORP (JP)
International Classes:
H01L27/146; H01L31/02
Foreign References:
JP2013175494A2013-09-05
JP2016162917A2016-09-05
JP2007115994A2007-05-10
US20120009720A12012-01-12
US20130307040A12013-11-21
JP2015029013A2015-02-12
JP2011091341A2011-05-06
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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