SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE - SONY SEMICONDUCTOR SOLUTIONS CORP

Title:

SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2020/059510

Kind Code:

A1

Abstract:

This invention relates to a solid-state imaging element and an electronic device which make it possible to increase the capacitance of a charge holding unit. The solid-state imaging device is provided with pixels comprising a photodiode, an FD which accumulates charge generated in the photodiode, and a charge holding unit which is connected in parallel to the FD. This charge holding unit consists of a wiring capacitance which is formed by the parallel arrangement of a first wiring connected to a first potential and a second wiring connected to a second potential different from the first potential. The present invention may be applied to a solid-state imaging device which performs global shutter imaging.

More Like This:

JP2001007981	PHOTOELECTRIC CONVERTER AND IMAGE PICKUP SYSTEM USING IT
WO/2021/215066	LIGHT DETECTOR AND ELECTRONIC INSTRUMENT
WO/2019/132857	SENSOR SYSTEM

Inventors:

OTAKE YUSUKE (JP)
WAKANO TOSHIFUMI (JP)
MURASE TAKURO (JP)

Application Number:

PCT/JP2019/034901

Publication Date:

March 26, 2020

Filing Date:

September 05, 2019

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SONY SEMICONDUCTOR SOLUTIONS CORP (JP)

International Classes:

H01L27/146; H01L21/3205; H01L21/768; H01L23/522; H01L31/10; H04N5/3745

Foreign References:

JP2011199185A	2011-10-06
JP2017519352A	2017-07-13
JP2015056878A	2015-03-23
JP2013033896A	2013-02-14
JP2008166810A	2008-07-17
KR20040093905A	2004-11-09
JP2018064199A	2018-04-19

Other References: