Title:
SOLID-STATE IMAGING ELEMENT AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/092632
Kind Code:
A1
Abstract:
The present technology pertains to a solid-state imaging element that can improve image quality by suppressing reflection and diffraction, and a manufacturing method. This solid-state imaging element is provided with: a substrate that has a photoelectric conversion unit in each pixel; and a reflectance adjustment layer that adjusts reflection of incident light on the substrate and that is provided on a side of the substrate which becomes the incident direction of the incident light with respect to the substrate, wherein the reflectance adjustment layer comprises a first layer formed on the substrate and a second layer formed on the first layer, the first layer has a recess-projection structure provided on the substrate, a recess part of the recess-projection structure is filled with a material having a refractive index lower than that of the substrate constituting the second layer, and the thickness of the first layer is optimally set for the wavelength of light to be received. The present technology can be applied to an imaging element.
Inventors:
TAKEUCHI KOICHI (JP)
Application Number:
PCT/JP2017/040043
Publication Date:
May 24, 2018
Filing Date:
November 07, 2017
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G02B1/115; H01L27/146; G03F7/20; H01L21/027; H04N5/369
Domestic Patent References:
| WO2015170629A1 | 2015-11-12 | |||
| WO2016194654A1 | 2016-12-08 |
Foreign References:
| JP2009218357A | 2009-09-24 | |||
| JP2015029054A | 2015-02-12 | |||
| JP2009088261A | 2009-04-23 | |||
| JP2013068882A | 2013-04-18 | |||
| JP2012108369A | 2012-06-07 | |||
| JP2013198661A | 2013-10-03 | |||
| JP2015092631A | 2015-05-14 | |||
| JP2013033864A | 2013-02-14 | |||
| JP2005072097A | 2005-03-17 | |||
| JP2008311562A | 2008-12-25 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
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