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Patent Searching and Data


Title:
SOLID-STATE IMAGING ELEMENT AND METHOD FOR MANUFACTURING SOLID-STATE IMAGING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2018/194069
Kind Code:
A1
Abstract:
Provided are a solid-state imaging element in which color mixing is reduced and which has high resolution and sensitivity, and a method for manufacturing the same. A solid-state imaging element according to the present embodiment comprises: a semiconductor substrate (10) having a plurality of photoelectric conversion elements (11) two-dimensionally arranged thereon; and a color filter pattern which is disposed on the semiconductor substrate (10) and in which a plurality of colors of color filters (14, 15, 16) are arranged in correspondence to the respective photoelectric conversion elements (11). A partition wall layer (12) is formed in which a visible light-transmissive layer formed between the semiconductor substrate (10) and the color filters (14, 15, 16) and a visible light-transmissive layer formed between adjacent color filters (14, 15, 16) are successive. An edge portion of a color filter (14) with the largest area among the plurality of colors of color filters (14, 15, 16) and an edge portion included in the partition wall layer (12) are successive. A reaction product layer (40) obtained during etching of the partition wall layer (12) is formed on a side wall of the color filter (14) with the largest area.

Inventors:
TAKAHASHI SATOSHI (JP)
Application Number:
PCT/JP2018/015907
Publication Date:
October 25, 2018
Filing Date:
April 17, 2018
Export Citation:
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Assignee:
TOPPAN PRINTING CO LTD (JP)
International Classes:
H01L27/146; G02B5/20; H01L21/3065; H04N9/07
Foreign References:
JP2015166445A2015-09-24
JP2008077038A2008-04-03
JP2006163316A2006-06-22
JP2016197696A2016-11-24
JPS6468076A1989-03-14
JPS495760B11974-02-08
Other References:
See also references of EP 3614436A4
Attorney, Agent or Firm:
HIROSE Hajime et al. (JP)
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