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Patent Searching and Data


Title:
SOLUBLE MATERIAL FOR THREE-DIMENSIONAL MOLDING
Document Type and Number:
WIPO Patent Application WO/2016/059987
Kind Code:
A1
Abstract:
The present invention is a soluble material for three-dimensional molding and is used as a material for a support material that supports a three-dimensional object when said three-dimensional object is produced by a fused deposition modeling 3D printer. The soluble material for three-dimensional molding includes at least one copolymer comprising a specific hydrophilic monomer unit and a specific hydrophobic monomer unit. The present invention has a glass transition temperature suitable for the FDM method, has a high rate of dissolution in an alkaline aqueous solution, can be quickly removed from a precursor of a three-dimensional object, and makes it possible to minimize or reduce damage to a three-dimensional object.

Inventors:
YOSHIMURA, Tadanori (Research Laboratories 1334, Minato, Wakayama-sh, Wakayama 80, 〒6408580, JP)
KIMURA, Takuma (Research Laboratories 1334, Minato, Wakayama-sh, Wakayama 80, 〒6408580, JP)
HIRAI, Jouji (Research Laboratories 1334, Minato, Wakayama-sh, Wakayama 80, 〒6408580, JP)
Application Number:
JP2015/078113
Publication Date:
April 21, 2016
Filing Date:
October 02, 2015
Export Citation:
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Assignee:
KAO CORPORATION (14-10, Nihonbashi Kayabacho 1-chome Chuo-k, Tokyo 10, 〒1038210, JP)
International Classes:
B29C67/00; B33Y10/00; B33Y70/00; C08F220/06; C08F222/02
Foreign References:
JP2012509777A2012-04-26
JP2014511933A2014-05-19
JP2005531439A2005-10-20
Other References:
See also references of EP 3208073A4
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (First Shin-Osaka MT Bldg. 2nd Floor, 5-13-9 Nishinakajima Yodogawa-ku, Osaka-sh, Osaka 11, 〒5320011, JP)
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