Title:
SOLVENT-FREE AND ONE-PACK TYPE CYANIC ESTER/EPOXY COMPOSITE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2011/036836
Kind Code:
A1
Abstract:
A solvent-free and one-pack type cyanic ester/epoxy composite resin composition which exhibits excellent storage stability and curability and high heat resistance, characterized by comprising (A) a cyanic ester, (B) an epoxy resin, (C) a guanidine compound, and (D) at least one phenol compound selected from the group consisting of phenol compounds represented by the general formulae. In the general formulae, l is an integer of 0 to 4; and R1 is an unsubstituted or fluorine-substituted monovalent hydrocarbon group.
Inventors:
OGAWA RYO (JP)
YAMADA SHINSUKE (JP)
YAMADA SHINSUKE (JP)
Application Number:
PCT/JP2010/004721
Publication Date:
March 31, 2011
Filing Date:
July 23, 2010
Export Citation:
Assignee:
ADEKA CORP (JP)
OGAWA RYO (JP)
YAMADA SHINSUKE (JP)
OGAWA RYO (JP)
YAMADA SHINSUKE (JP)
International Classes:
C08G59/62; C08K5/31; C08K5/315; C08L63/00; C08L65/00; C09J11/04; C09J11/06; C09J11/08; C09J163/00; H01L23/29; H01L23/31
Foreign References:
| JP2002128864A | 2002-05-09 | |||
| JPS5375299A | 1978-07-04 | |||
| JP2001172473A | 2001-06-26 | |||
| JP2007204669A | 2007-08-16 | |||
| JP2001302767A | 2001-10-31 | |||
| JPH08176408A | 1996-07-09 |
Attorney, Agent or Firm:
TAKITA, Seiki et al. (JP)
Seiki Takita (JP)
Seiki Takita (JP)
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