SPATTERING DEVICE AND FILM FORMING METHOD

Title:

SPATTERING DEVICE AND FILM FORMING METHOD

Document Type and Number:

WIPO Patent Application WO/2007/086276

Kind Code:

A1

Abstract:

A spattering device (1) has first to fourth targets (21a) to (21d). The first and second targets (21a, 21b) are disposed so that their surfaces face each other. The third and fourth targets (21c, 21d) are also disposed so that their surfaces face each other. When a dielectric film is formed, the first and second targets (21a, 21b) and the third and fourth targets (21c, 21d) are alternately spattered. When two of the targets (21a to 21d) with their surfaces facing each other are spattered, the other two of the targets (21a to 21d) function as the earth. As the result, abnormal electric discharge can be suppressed.

Inventors:

TAKASAWA SATORU (JP)
UKISHIMA SADAYUKI (JP)
TANI NORIAKI (JP)
ISHIBASHI SATORU (JP)

Application Number:

PCT/JP2007/050479

Publication Date:

August 02, 2007

Filing Date:

January 16, 2007

Export Citation:

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Assignee:

ULVAC INC (JP)
TAKASAWA SATORU (JP)
UKISHIMA SADAYUKI (JP)
TANI NORIAKI (JP)
ISHIBASHI SATORU (JP)

International Classes:

C23C14/34; H01L21/31

Foreign References:

JPS61192032A	1986-08-26
JPH0313575A	1991-01-22
JP2003082456A	2003-03-19
JP2006089850A	2006-04-06
JPS6256575B2	1987-11-26

Other References: