Title:
SPUTTERING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/070031
Kind Code:
A1
Abstract:
This sputtering device (1) has a mask exchanging means (100) which makes it possible to replace a mask frame (F) held approximately perpendicularly with respect to a substrate (S) on which film formation is performed by sputtering within a chamber. The mask replacement means comprises: a stock chamber (50) which can be enclosed in an airtight manner to enable a plurality of mask frames to be stocked in a plane-parallel state; and a conveyance means (60) which conveys the plurality of stocked mask frames to the mask chamber (43) which is in a film-forming position within the chamber (4). The stock chamber is provided with: stock support units (51, 52, 53, 54) which enable front-rear movement in an approximately orthogonal direction to the mask surface of a mask frame; drive support units (55, 65) which can select a mask frame stocked in a stock support unit and drive said frame in the planar direction; and conveyance support units (56, 66) which can support the upper edge of the mask frame so as not to tilt when the mask frame is being moved by a drive support unit.
Inventors:
YOSHIDA DAISUKE (JP)
SHIMIZU TSUYOSHI (JP)
TAKAHASHI MAKOTO (JP)
YUYAMA AKIRA (JP)
SATOU YUSUKE (JP)
SHIMIZU TSUYOSHI (JP)
TAKAHASHI MAKOTO (JP)
YUYAMA AKIRA (JP)
SATOU YUSUKE (JP)
Application Number:
PCT/JP2018/037229
Publication Date:
April 11, 2019
Filing Date:
October 04, 2018
Export Citation:
Assignee:
ULVAC INC (JP)
International Classes:
C23C14/34; C23C14/04; H01L51/50; H05B33/10
Foreign References:
JP3205676U | 2016-08-12 | |||
JP2004292863A | 2004-10-21 | |||
JP2014109052A | 2014-06-12 | |||
JP2013237914A | 2013-11-28 | |||
JP2012072478A | 2012-04-12 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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