Title:
SPUTTERTARGET
Document Type and Number:
WIPO Patent Application WO2002012584
Kind Code:
A3
Abstract:
A sputtering target used in carrying out a PVD coating process where the sputtering target is sputtered by bombardment with gas atoms and a layer consisting of several metallic elements is deposited onto a substrate, the sputtering target being a plate made of a metal used for building up the layer, and with the other metals used for building up the layer being present at least partially in the form of plugs, which are inserted in holes in the plate, the shape of the free surfaces of the plugs being selected in such a way that the sputtering rate for each metal used in the sputtering process can be set according to the desired composition of the layer being applied.
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Inventors:
HERMELER BERND (DE)
WUROPULOS ALEXANDER (DE)
WUROPULOS ALEXANDER (DE)
Application Number:
PCT/EP2001/009119
Publication Date:
April 25, 2002
Filing Date:
August 07, 2001
Export Citation:
Assignee:
CEMECON CERAMIC METAL COATINGS (DE)
HERMELER BERND (DE)
WUROPULOS ALEXANDER (DE)
HERMELER BERND (DE)
WUROPULOS ALEXANDER (DE)
International Classes:
C23C2/00; C23C14/34
Foreign References:
| US4610774A | 1986-09-09 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 011, no. 163 (C - 424) 26 May 1987 (1987-05-26)
PATENT ABSTRACTS OF JAPAN vol. 011, no. 185 (C - 428) 13 June 1987 (1987-06-13)
PATENT ABSTRACTS OF JAPAN vol. 006, no. 122 (C - 112) 7 July 1982 (1982-07-07)
PATENT ABSTRACTS OF JAPAN vol. 011, no. 185 (C - 428) 13 June 1987 (1987-06-13)
PATENT ABSTRACTS OF JAPAN vol. 006, no. 122 (C - 112) 7 July 1982 (1982-07-07)
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