Title:
STAMPING DEVICE AND STAMPING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/085218
Kind Code:
A1
Abstract:
The present invention provides a stamping device and a stamping system with which it is possible to simplify the configuration required for workpiece detection, and reduce erroneous detection of placement of a workpiece in a die. This stamping device has mounted therein a die set having a plurality of dies. The plurality of dies are provided as aligned in the width direction in the die set. Workpieces to be processed are respectively placed in the plurality of dies. The stamping device comprises: a limit switch (32) that detects the movement of a plate pressed by pins that are provided to the plurality of dies; a foot switch (32) that detects a user operation for driving the die set; a switching unit (14) that switches between detection by the limit switch (32) and detection by the foot switch (15); and a control unit (7) that drives the die set on the basis of the detection result from the limit switch (32) or the foot switch (15).
Inventors:
MATSUKAWA SHINICHI (JP)
TAJIMA JUNICHI (JP)
TAJIMA JUNICHI (JP)
Application Number:
PCT/JP2022/041297
Publication Date:
May 19, 2023
Filing Date:
November 07, 2022
Export Citation:
Assignee:
TAJIMA MECH CORPORATION (JP)
International Classes:
B30B13/00; B30B15/00; B30B15/02
Foreign References:
| JPH0570728U | 1993-09-24 | |||
| JPH0583955U | 1993-11-12 |
Attorney, Agent or Firm:
FUJITA, Takaharu (JP)
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