Title:
STRESS REDUCING AGENT AND RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/190135
Kind Code:
A1
Abstract:
The present invention provides a stress reducing agent (i) which has excellent dispersibility in a matrix resin, and (ii) which enables the achievement of a cured product that has a good linear expansion coefficient. The above is achieved by means of a stress reducing agent which contains polymer fine particles (A), wherein: the polymer fine particles (A) contain a rubber-containing graft copolymer which comprises an elastic body and a graft part that is grafted to the elastic body; the elastic body contains an organosiloxane rubber; the elastic body is contained in an amount of more than 70% by weight but not more than 97% by weight relative to 100% by weight of the polymer fine particles (A); the graft part comprises an epoxy group-containing constituent unit; the epoxy group-containing constituent unit in the graft part is contained in an amount of 0.5% by weight to 4.0% by weight relative to 100% by weight of the rubber-containing graft copolymer; and this stress reducing agent is in the form of a particulate matter.
Inventors:
MAIZURU NOBUYOSHI (JP)
Application Number:
PCT/JP2023/011771
Publication Date:
October 05, 2023
Filing Date:
March 24, 2023
Export Citation:
Assignee:
KANEKA CORP (JP)
International Classes:
C08L83/04; C08F283/12; C08L63/00
Domestic Patent References:
| WO2017188286A1 | 2017-11-02 |
Foreign References:
| JP2007146148A | 2007-06-14 | |||
| JP2010090371A | 2010-04-22 | |||
| JP2015078280A | 2015-04-23 | |||
| JPH0525377A | 1993-02-02 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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