STRUCTURE FOR COOLING SEMICONDUCTOR ELEMENT

Title:

STRUCTURE FOR COOLING SEMICONDUCTOR ELEMENT

Document Type and Number:

WIPO Patent Application WO/2008/096839

Kind Code:

A1

Abstract:

A structure for cooling a semiconductor element is provided with a semiconductor element (1); a heat sink (2) whereupon the semiconductor element (1) is mounted; and a heat storage member (3), which is attached to the semiconductor element (1) on a side opposite to the side whereupon the heat sink (2) is mounted, and includes a case (31) and a latent heat storage material (32).

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Inventors:

YOSHIDA TADAFUMI (JP)
OSADA HIROSHI (JP)
YOKOI YUTAKA (JP)

Application Number:

PCT/JP2008/052094

Publication Date:

August 14, 2008

Filing Date:

February 04, 2008

Export Citation:

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Assignee:

TOYOTA MOTOR CO LTD (JP)
YOSHIDA TADAFUMI (JP)
OSADA HIROSHI (JP)
YOKOI YUTAKA (JP)

International Classes:

H01L23/473

Foreign References:

JP2005150419A	2005-06-09
JP2005093848A	2005-04-07
JP2007019203A	2007-01-25

Attorney, Agent or Firm:

FUKAMI, Hisao et al. (Nakanoshima Central Tower 22nd Floor, 2-7, Nakanoshima 2-chome, Kita-ku, Osaka-sh, Osaka 05, JP)

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