Title:
STRUCTURE AND METHOD FOR DETECTING SEPARATION IN STRUCTURES
Document Type and Number:
WIPO Patent Application WO/2014/080677
Kind Code:
A1
Abstract:
The invention pertains to a structure and a method for detecting separation in a structure capable of detecting with precision separation damage to bonded portions. A structure (1) has a first member (2) and a second member (3) bonded so that a bonding face (5) having a plurality of projections (4) is on one end of the first member (2), and a strain measuring device (7) is disposed, in the vicinity of the projections (4) of the second member (3), in the direction that the bonding face (5) of the structure (1) extends. Strain that is generated on the structure (1) when a load is applied to the structure (1) is detected, strain distribution in the location corresponding to the projections (4) is acquired, and fracturing and the presence of separation failure in the bonded portion are determined on the basis of changes in the strain distribution.
Inventors:
SAITO NOZOMI (JP)
YARI TAKASHI (JP)
YARI TAKASHI (JP)
Application Number:
PCT/JP2013/073993
Publication Date:
May 30, 2014
Filing Date:
September 05, 2013
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
G01N19/04; G01N3/00
Foreign References:
| JP2001021384A | 2001-01-26 | |||
| JPH11218475A | 1999-08-10 | |||
| JPH09101255A | 1997-04-15 |
Other References:
TAKASHI YARI: "Development of a BOCDA-SHM System to Reduce Airplane Operating Costs", MITSUBISHI HEAVY INDUSTRIES TECHNICAL REVIEW, vol. 48, no. 4, December 2011 (2011-12-01)
Attorney, Agent or Firm:
FUJITA, Takaharu et al. (JP)
Takaharu Fujita (JP)
Takaharu Fujita (JP)
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