Title:
STRUCTURE AND METHOD FOR JOINING METAL MEMBERS
Document Type and Number:
WIPO Patent Application WO/2001/002121
Kind Code:
A1
Abstract:
A joining structure for metal members, which joins a first metal member and a second metal member together by soldering, wherein at least one of the first and second metal members are SnZn-alloy-plated, and an SnAg alloy is used as a solder, whereby the heat deterioration of a solder and plating-to-plating contact corrosion can be prevented, a soldering spreading is improved, and the corrosion resistance and qualities such as a joint strength of a joining structure are also improved.
Inventors:
TAKIKAWA KAZUNORI (JP)
NARITA MASAYUKI (JP)
NARITA MASAYUKI (JP)
Application Number:
PCT/JP2000/004350
Publication Date:
January 11, 2001
Filing Date:
June 30, 2000
Export Citation:
Assignee:
HONDA MOTOR CO LTD (JP)
YACHIYO KOGYO KK (JP)
TAKIKAWA KAZUNORI (JP)
NARITA MASAYUKI (JP)
YACHIYO KOGYO KK (JP)
TAKIKAWA KAZUNORI (JP)
NARITA MASAYUKI (JP)
International Classes:
B23K1/00; B23K1/002; B23K1/18; B23K1/19; B23K1/20; B23K35/00; B23K35/26; B60K15/03; C23C2/08; C25D5/26; C25D7/00; F16L13/08; (IPC1-7): B23K1/20; B23K1/18
Foreign References:
| JPH0871741A | 1996-03-19 | |||
| JPH0663731A | 1994-03-08 | |||
| JPH091381A | 1997-01-07 | |||
| JPH11114667A | 1999-04-27 |
Other References:
See also references of EP 1118413A4
Attorney, Agent or Firm:
Suenari, Mikio (Kyobashi 2-chome Chuo-ku Tokyo, JP)
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