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Patent Searching and Data


Title:
SUBSTRATE CARRIER DEVICE FOR DOUBLE-SIDED ELECTROPLATING OF SOLAR CELL
Document Type and Number:
WIPO Patent Application WO/2013/151365
Kind Code:
A1
Abstract:
The present invention relates to a substrate carrier device for double-sided electroplating of a solar cell. The substrate carrier device (100) of the present invention comprises: wafer accommodation areas (105) which have apertures and support the rims of wafers to be accommodated through a plurality of first protrusive support portions (140) and a plurality of second protrusive support portions (150) provided on the edges of the wafer accommodation areas; clip mounting rods(106, 107, 108, 109) which are respectively provided on the left sides of the wafer accommodation areas and rotate at fixed positions, and which operate the opening (contact points with wafers are formed) and closing (contact points with wafers are released) of the clips; a plurality of first clips (160) which are provided on the clip mounting rods, and in which the opening and closing of the clips are determined by the rotation of the clip mounting rods; and a plurality of second clips (170) which are provided around the wafer accommodation areas (105) on a second side, and which penetrate holes (151) formed in the second protrusive support portions (150).

Inventors:
KIM PAN SOO (KR)
LEE DUK HAENG (KR)
JUNG WOON SUK (KR)
Application Number:
KR2013/002830
Publication Date:
October 10, 2013
Filing Date:
April 05, 2013
Export Citation:
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Assignee:
HOJIN PLATECH CO LTD (KR)
International Classes:
C25D17/06; C25D7/12
Foreign References:
US20120073976A12012-03-29
US20050061665A12005-03-24
US5580432A1996-12-03
KR20080034992A2008-04-22
US4796157A1989-01-03
Attorney, Agent or Firm:
LIM, Seung-Seop et al. (KR)
임승섭 (KR)
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