SUBSTRATE CARRIER DEVICE FOR DOUBLE-SIDED ELECTROPLATING OF SOLAR CELL

WIPO Patent Application WO/2013/151365

A1

The present invention relates to a substrate carrier device for double-sided electroplating of a solar cell. The substrate carrier device (100) of the present invention comprises: wafer accommodation areas (105) which have apertures and support the rims of wafers to be accommodated through a plurality of first protrusive support portions (140) and a plurality of second protrusive support portions (150) provided on the edges of the wafer accommodation areas; clip mounting rods(106, 107, 108, 109) which are respectively provided on the left sides of the wafer accommodation areas and rotate at fixed positions, and which operate the opening (contact points with wafers are formed) and closing (contact points with wafers are released) of the clips; a plurality of first clips (160) which are provided on the clip mounting rods, and in which the opening and closing of the clips are determined by the rotation of the clip mounting rods; and a plurality of second clips (170) which are provided around the wafer accommodation areas (105) on a second side, and which penetrate holes (151) formed in the second protrusive support portions (150).

KIM PAN SOO (KR)
LEE DUK HAENG (KR)
JUNG WOON SUK (KR)

PCT/KR2013/002830

October 10, 2013

April 05, 2013

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HOJIN PLATECH CO LTD (KR)

C25D17/06; C25D7/12

US20120073976A1	2012-03-29
US20050061665A1	2005-03-24
US5580432A	1996-12-03
KR20080034992A	2008-04-22
US4796157A	1989-01-03

LIM, Seung-Seop et al. (KR)
임승섭 (KR)

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