Title:
SUBSTRATE CLEANING DEVICE, SUBSTRATE PROCESSING DEVICE, SUBSTRATE CLEANING METHOD, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2023/195537
Kind Code:
A1
Abstract:
This substrate cleaning device comprises: a cleaning module which includes a transfer mechanism for transferring a substrate in a first direction, and which performs cleaning by causing a cleaning member rotating around a rotation axis extending in a second direction not perpendicular to the first direction to abut on the substrate being transferred in the first direction; and a control device which, on the basis of information regarding at least one of the substrate and the cleaning module, changes a cleaning condition including at least one of the direction of the rotation axis, the rotational speed of the cleaning member, and the transfer speed of the substrate.
Inventors:
ISHII YU (JP)
Application Number:
PCT/JP2023/014402
Publication Date:
October 12, 2023
Filing Date:
April 07, 2023
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
H01L21/304
Foreign References:
| JPH0555546U | 1993-07-23 | |||
| JP4287551B2 | 2009-07-01 | |||
| JP2021103723A | 2021-07-15 | |||
| JP2008004747A | 2008-01-10 | |||
| JP2016064357A | 2016-04-28 | |||
| JPH07241534A | 1995-09-19 | |||
| JPH10314684A | 1998-12-02 | |||
| JP2005191216A | 2005-07-14 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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