SUBSTRATE CLEANING METHOD

WIPO Patent Application WO/2010/104207

A1

Provided is a substrate cleaning method by which a substrate having a fine pattern formed thereon is cleaned in a short time without affecting the fine pattern. A wafer (W), on which the fine pattern having a groove or a hole with a representative length of 0.1 μm or less is formed, is disposed in a space containing moisture such that the wafer (W) faces, at a fixed interval, the leading edge portion of a discharge electrode (45), which has the sharp leading edge portion and can be cooled, by having a counter electrode (46) disposed at a predetermined position between the wafer and the leading edge portion. The discharge electrode (45) is cooled so as to form dew on the discharge electrode (45), and a constant voltage is applied to between the discharge electrode (45) and the counter electrode (46). At the time of applying the constant voltage, an aerosol containing fine water particles having a diameter of 10 nm or less is generated at the leading edge portion of the discharge electrode (45), and the wafer (W) is cleaned by spraying the aerosol to the wafer (W).

MORIYA TSUYOSHI (JP)
YOKOYAMA SHIN (JP)
OKUYAMA KIKUO (JP)

PCT/JP2010/054482

September 16, 2010

March 10, 2010

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TOKYO ELECTRON LTD (JP)
MORIYA TSUYOSHI (JP)
YOKOYAMA SHIN (JP)
OKUYAMA KIKUO (JP)

H01L21/304

JPH11330033A	1999-11-30
JP2008186864A	2008-08-14
JP2007201374A	2007-08-09
JP2000021726A	2000-01-21
JP2007317463A	2007-12-06

BECCHAKU, Shigehisa et al. (JP)
Role of another Shigehisa (JP)

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