Title:
SUBSTRATE WASHING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/104206
Kind Code:
A1
Abstract:
A substrate washing method which is able to be implemented by a simple apparatus configuration and washes a substrate, which has a fine pattern formed thereon, in a short period of time without having a detrimental effect on that fine pattern. The method comprises transporting the wafer (W) from a processing chamber, which processes the surface of the wafer (W) in a predetermined manner, to a washing chamber, which washes the wafer (W); cooling the wafer (W) inside the washing chamber to a predetermined temperature; feeding superfluid helium as a superfluid to the surface of the wafer (W); and washing away the contaminating components in the fine pattern by flushing out the superfluid from the surface of the wafer (W).
Inventors:
MATSUI HIDEFUMI (JP)
MORIYA TSUYOSHI (JP)
NISHIMURA EIICHI (JP)
KAWAGUCHI SHINICHI (JP)
YAMAWAKU JUN (JP)
MIYAUCHI KUNIO (JP)
MORIYA TSUYOSHI (JP)
NISHIMURA EIICHI (JP)
KAWAGUCHI SHINICHI (JP)
YAMAWAKU JUN (JP)
MIYAUCHI KUNIO (JP)
Application Number:
PCT/JP2010/054481
Publication Date:
September 16, 2010
Filing Date:
March 10, 2010
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
MATSUI HIDEFUMI (JP)
MORIYA TSUYOSHI (JP)
NISHIMURA EIICHI (JP)
KAWAGUCHI SHINICHI (JP)
YAMAWAKU JUN (JP)
MIYAUCHI KUNIO (JP)
MATSUI HIDEFUMI (JP)
MORIYA TSUYOSHI (JP)
NISHIMURA EIICHI (JP)
KAWAGUCHI SHINICHI (JP)
YAMAWAKU JUN (JP)
MIYAUCHI KUNIO (JP)
International Classes:
H01L21/304; B08B3/08; B08B3/10; B08B3/14; B08B7/00; H01L21/3065
Foreign References:
| JP2003298154A | 2003-10-17 | |||
| JP2008034858A | 2008-02-14 |
Attorney, Agent or Firm:
BECCHAKU Shigehisa et al. (JP)
Role of another Shigehisa (JP)
Role of another Shigehisa (JP)
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