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Title:
SUBSTRATE CLEANING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/094389
Kind Code:
A1
Abstract:
This substrate cleaning method cleans a substrate to be processed by blasting thereon, from a nozzle part, a gas cluster generated by supplying a gas for cluster generation to the nozzle part, while moving the nozzle part and rotating the substrate to be processed in a chamber. The method comprises: a step for removing initial particles on the substrate to be processed by a first cleaning process executed with a prescribed condition; and a step for performing, at least once on the substrate to be processed, a second cleaning process executed with a cleaning condition which is shorter in time than that of the first cleaning process.

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Inventors:
SAITO YUKIMASA (JP)
DOBASHI KAZUYA (JP)
FUJIHARA JIN (JP)
MORIYA SHUJI (JP)
Application Number:
PCT/JP2016/081067
Publication Date:
June 08, 2017
Filing Date:
October 20, 2016
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304
Foreign References:
JP2013175681A2013-09-05
JP2011171584A2011-09-01
JP2009043975A2009-02-26
JP2012114210A2012-06-14
JPH06295895A1994-10-21
Attorney, Agent or Firm:
TAKAYAMA Hiroshi (JP)
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