Title:
SUBSTRATE CONNECTING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2011/052068
Kind Code:
A1
Abstract:
Provided is a connecting structure having a support fitting where a main substrate is installed and a shield fitting that houses an interconnection substrate. The support fitting is equipped with a first opening that exposes a first connector provided in the main substrate, a first guide unit, and a hinge pair. The shield fitting is equipped with a second opening that exposes a second connector provided to the interconnection substrate, and a second guide unit that works in unison with the first guide unit. The first and second guide units guide the shield fitting so that the shield fitting moves perpendicularly in relation to the main surface of the support fitting that is equipped with the first opening. Each end of the hinge pair is positioned between the shield fitting and the support fitting, and separates the shield fitting from the support fitting when rotated.
Inventors:
TAKEDA MIKIYA (JP)
Application Number:
PCT/JP2009/068667
Publication Date:
May 05, 2011
Filing Date:
October 30, 2009
Export Citation:
Assignee:
NEC DISPLAY SOLUTIONS LTD (JP)
TAKEDA MIKIYA (JP)
TAKEDA MIKIYA (JP)
International Classes:
H01R13/658; H05K9/00; H05K1/14
Foreign References:
| JP2001265464A | 2001-09-28 | |||
| JPH04147588A | 1992-05-21 | |||
| JP2007157984A | 2007-06-21 | |||
| JPH06140097A | 1994-05-20 | |||
| JP2007234736A | 2007-09-13 | |||
| JPH02106860U | 1990-08-24 |
Attorney, Agent or Firm:
MIYAZAKI, Teruo et al. (JP)
Akio Miyazaki (JP)
Akio Miyazaki (JP)
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