Title:
SUBSTRATE HEATING DEVICE AND SUBSTRATE HEATING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/022069
Kind Code:
A1
Abstract:
[Problem] To rapidly create a low oxygen atmosphere around a substrate when heating the substrate. [Solution] A device is configured to include: a peripheral part that surrounds the sides of a heating plate such that a gap is formed between the heating plate and the peripheral part around the entire periphery of the heating plate; a processing space forming part that is provided facing the heating plate and the peripheral part such that a processing space in which the substrate is heated and with which the gap communicates is formed between the heating plate and the peripheral part; a gas supply part that supplies, from one end of the processing space toward the other end, a low oxygen atmosphere forming gas for creating a low oxygen atmosphere in the processing space when heating the substrate, and forms a current of air that covers the entire width of the substrate and flows from the one end of the processing space toward the other end; an exhaust port which is provided on the other end of the processing space; and a replacing part for replacing the gas accumulated in the gaps before the current of air is formed with the low oxygen atmosphere forming gas before the heating of the substrate.
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Inventors:
OOTANI HIBIKI (JP)
HISADA KOSUKE (JP)
HISADA KOSUKE (JP)
Application Number:
PCT/JP2019/027387
Publication Date:
January 30, 2020
Filing Date:
July 10, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/31; H01L21/027; H01L21/316; H01L21/324
Foreign References:
| JPH02274877A | 1990-11-09 | |||
| JP2016127063A | 2016-07-11 | |||
| JP2008166604A | 2008-07-17 | |||
| JP2006313863A | 2006-11-16 | |||
| JP2010272765A | 2010-12-02 | |||
| JP2007067111A | 2007-03-15 |
Attorney, Agent or Firm:
YAYOY PATENT OFFICE (JP)
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