Title:
SUBSTRATE HOLDING METHOD, SUBSTRATE HOLDING DEVICE, PROCESSING METHOD AND PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/163147
Kind Code:
A1
Abstract:
Fine suction grooves 7b for sucking a wafer W are provided in a holding surface 7a of a stage 7. The suction grooves 7b are divided into, for instance, nine suction regions 61A-61I. The suction region 61I sucks a center portion of the circular wafer W. The suction regions 61A, 61B, 61C, 61D, 61E, 61F, 61G and 61H suck a peripheral end portion of the circular wafer W. A gas is separately jetted to nine positions on the wafer W held by the stage 7, said nine positions corresponding to the suction regions 61A-61I.
Inventors:
OBIKANE TADASHI (JP)
SHIBATA HIDEKAZU (JP)
SHIBATA HIDEKAZU (JP)
Application Number:
PCT/JP2016/053953
Publication Date:
October 13, 2016
Filing Date:
February 10, 2016
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/683; H01L21/66
Foreign References:
| JP2010129706A | 2010-06-10 | |||
| JP2014195016A | 2014-10-09 | |||
| JP2012201437A | 2012-10-22 | |||
| JP2013232630A | 2013-11-14 | |||
| JP2000124298A | 2000-04-28 |
Other References:
See also references of EP 3282475A4
Attorney, Agent or Firm:
WATANABE Kazuhiro et al. (JP)
Kazuhiro Watanabe (JP)
Kazuhiro Watanabe (JP)
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